Production

Thinfilm Hybrids

Quintenz Datenblatt

Substrate Materials

  • ceramics Al2O3, AlN
  • Glass, Quartz and Fused Silica, Sapphire
  • Si, SiC, others on request

Layer Systems

  • different CrNi/Au-systems , e.g. CrNi/W/Ti/Pd/Au
  • Cu based systems
  • other layer compositions on request

Resistors

  • CrNi-substrate resistors (integrated) with surface resistivities from 10Ω/□ to 300Ω/□
  • <25ppm/K, trim to 0.01%
  • chip resistors (dice) from 0.1Ω-100GΩ
  • standard resistors (glued or soldered)

Suitable for

  • soldering techniques, gluing techniques, bonding (Al and Au)

 

 

Thickfilm Hybrids

Quintenz Datenblatt

Substrate Materials

  • ceramics Al2O3 (4in x 4in)
  • ceramics AlN (2in x 2in)
  • others on request

Conductors

  • PdAg, Au, Ag, PtAg
  • min. 80µm (3.15mil) distance, min. 100µm (4mil) width

Resistors

  • thickfilm resistors (integrated), trim down to 0.1%
  • <25ppm/K, trim to 0.01%
  • chip resistors (dice) from 0.1Ω-100GΩ
  • standard resistors (glued or soldered)

Suitable for

  • soldering techniques, gluing techniques, bonding (Al and Au)

 

Chip on Board (COB)

COB technology on PCB and Flex materials. Other base materials on request. 

 

Assembly

Assembly - Placement

  • all standard components
  • dice, unpackaged components/semiconductors
  • precision mounting of optical components (CCD, LED, sensor etc.)


Assembly of Modules and Appliances

  • assembly of modules and appliances by commissioned production
  • manufacturing and test of optical modules and appliances
 

Documentation

Documentation and security rules are enforced on a high level

  • 100% traceability
  • detailed test documentation 
 

Packaging

Packaging

  • Packaging of Hybrids and Printed Circuit Boards
  • Packages for special applications
  • MEMS-Packaging
  • Packaging of optical components